型 号
|
厂 家
|
封 装
|
批 号
|
UCC37324D
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
UCC37323P
|
TI
|
8-DIP (300 mil)
|
10+
|
UCC37323DGN
|
TI
|
8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
|
10+
|
UCC37323D
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
UCC37322P
|
TI
|
8-DIP (300 mil)
|
10+
|
UCC37322DGN
|
TI
|
8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
|
10+
|
UCC37322D
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
UCC37321P
|
TI
|
8-DIP (300 mil)
|
10+
|
UCC37321DGN
|
TI
|
8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
|
10+
|
UCC37321D
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
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