|
型 号
|
厂 家
|
封 装
|
批 号
|
|
UCC27423DGN
|
TI
|
8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
|
10+
|
|
UCC27423D
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
|
UCC27325P
|
TI
|
8-DIP (300 mil)
|
10+
|
|
UCC27325DR
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
|
UCC27325DGN
|
TI
|
8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
|
10+
|
|
UCC27325D
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
|
UCC27324QDRQ1
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
|
UCC27324P
|
TI
|
8-DIP (300 mil)
|
10+
|
|
UCC27324D
|
TI
|
8-SOIC (3.9mm Width)
|
10+
|
|
UCC27323P
|
TI
|
8-DIP (300 mil)
|
10+
|
|
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