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| XC3S1500-4FGG456C资料 | |
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XC3S1500-4FGG456C PDF Download |
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File Size : 116 KB
Manufacturer:XILINX Description:After the erase instruction is entered, CS must be brought LOW. The falling edge of CS initiates the self-timed internal programming cycle. Bringing CS HIGH after a minimum of tCS, will cause DOUT to indicate the READ/BUSY status of the chip: a logical 0 indicates programming is still in progress; a logical 1 indicates the erase cycle is complete and the part is ready for another instruction (see Figure 8). |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：XC3S1500-4FGG456C 厂 家：XILINX 封 装：BGA456 批 号：1230+ 数 量：900 说 明： XC3S1500-4FGG456C
产品参数： 标准包装 60/托盘 类别 集成电路 (IC) 家庭 嵌入式 - FPGA（现场可编程门阵列） 系列 Spartan®-3 LAB/CLB数 3328 逻辑元件/单元数 29952 RAM 位总计 589824 输入/输出数 333 门数 1500000 电源电压 1.14 V ~ 1.26 V 安装类型 表面贴装 工作温度 0°C ~ 85°C 封装 456-BBGA |
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